P/T Temporary Packaging Engineering Technician 2

Skyworks Solutions, Inc
United States, California, Irvine
5260 California Avenue (Show on map)
Nov 01, 2025
If you are looking for a challenging and exciting career in the world of technology, then look no further. Skyworks is an innovator of high-performance analog semiconductors whose solutions are powering the wireless networking revolution. Through our broad technology expertise and one of the most extensive product portfolios in the industry, we are Connecting Everyone and Everything, All the Time. At Skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management, and the freedom to make meaningful contributions in a setting that encourages creative thinking. We are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together are changing the way the world communicates. Requisition ID:76493 Description We are seeking a Temporary Materials/Engineering Technician with hands-on experience in cross-section preparation and analysis, semiconductor packaging, and Assembly manufacturing processes. The ideal candidate will support product development, and root cause investigations through detailed material and structural analysis of electronic assemblies. Responsibilities Supports engineering activities such as Performcross-section sample preparationon semiconductor devices using mechanical polishing. Conductoptical microscopy, SEM/EDX, and X-ray inspectionto analyze materials, defects, and interfaces. Collaborate withprocess, design, and quality engineeringteams to drive corrective actions and continuous improvement. Maintain and calibrate laboratory tools such as cross-section polishers and imaging systems. Document analysis results through detailed technical reports and presentations. Required Experience and Skills Position requires a minimum AA and 1-2 years' experience in materials characterization and semiconductor packaging. Or, BA in Electrical Engineering, Material Science, Physics or equivalent disciplines (no experience required). Excellent problem- solving, documentation, and communication skills. Desired Experience and Skills Knowledge ofencapsulation, underfill, wire bonding, and flip-chip packaging. Proficiency withfailure analysis software and data management tools. Fluency in MS Office Suite Hands-on experience withcross-section preparation, SEM/EDX analysis, and metallography. Working knowledge ofsemiconductor device structures, solder metallurgy, PCB fabrication, and SMT assembly processes. Supportfailure analysis (FA)for components, substrates, solder joints, vias, and multilayer boards. Skyworks is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, protected veteran status, or any other characteristic protected by law.